Smsc USB97C242 Manual do Utilizador descarregar pdf (Página 20)

USB 2.0 Flash Drive Controller

Datasheet

SMSC USB97C242 Page 20 Revision 1.4 (05-03-07)

DATASHEET

Chapter 9 Package Outline

Figure 9.1 – 100 Pin TQFP Package Outline, 12x12x1.4 Body (Rev A)

Table 9.1 – 100 Pin TQFP Package Parameters (Rev A)

MIN NOMINAL MAX REMARKS

~ ~ 1.60 Overall Package Height

0.05 ~ 0.15 Standoff

1.35 ~ 1.45 Body Thickness

13.80 ~ 14.20 X Span

11.80 ~ 12.20 X body Size

13.80 ~ 14.20 Y Span

11.80 ~ 12.20 Y body Size

0.09 ~ 0.20 Lead Frame Thickness

0.45 0.60 0.75 Lead Foot Length

~ 1.00 ~ Lead Length

0.40 Basic Lead Pitch

~ 7

Lead Foot Angle

0.13 0.16 0.23 Lead Width

0.08 ~ ~ Lead Shoulder Radius

0.08 ~ 0.20 Lead Foot Radius

ccc

~ ~ 0.08 Coplanarity

Notes:

Controlling Unit: millimeter.

Tolerance on the position of the leads is ± 0.035 mm maximum.

Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm.

Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.

Details of pin 1 identifier are optional but must be located within the zone indicated.

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